Polyamide synthesis

Product Code CAS NO. Product Name Product Role
03140 007681-65-4 Copper (I)-iodide pure

Heat & Light Stabilization

02116 7787-70-4 Copper(I) bromide

Heat & Light Stabilization

04422 6303-21-5 Hypophosphorous acid 50 %, pure

Reducing agent for electroless nickel plating

04429 6303-21-5 Hypophosphorous acid 50 %, technical

Reducing agent for electroless nickel plating

04423 6303-21-5 Hypophosphorous acid 60 %, pure

Reducing agent for electroless nickel plating

04414 7783-16-6 Manganese(II) hypophosphite-1-hydrate extra pure, meets analytical specification of BPC63

Catalyst; Heat & Light Stabilization

04411 7782-87-8 Potassium hypophosphite extra pure, meets analytical specification of BPC63

Reducing agent for electroless nickel plating

30315 7681-11-0 Potassium iodide Analytical Reagent, Reag. ISO, Reag. Ph. Eur.

Heat & Light Stabilization

03124 7681-11-0 Potassium iodide extra pure, meets analytical specification of Ph. Eur., BP, USP

Heat & Light Stabilization

04434 007681-53-0 Sodium hypophosphite extra pure, meets analytical specification of BPC 63

Catalyst; Heat & Light Stabilization

04415 10039-56-2 SODIUM HYPOPHOSPHITE-1-HYDRATE EXTRA PURE, meets analytical specification of DAC

Reducing agent for electroless nickel plating

30410 010039-56-2 Sodium hypophosphite-1-hydrate for analysis, Reag. Ph. Eur.

Catalyst; Heat & Light Stabilization

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